As an emerging thermal management solution, liquid metal-based chip cooling has become the subject of numerous seminal studies. This growing attention stems from the practicality and broad applicability of liquid metals in addressing the thermal management challenges posed by three-dimensional integrated circuits (3D ICs). With their superior heat transfer characteristics, liquid metals exhibit considerable potential to replace conventional heat transfer fluids. Compared with traditional chip cooling approaches, liquid metal-based technologies offer higher heat dissipation efficiency and enhanced overall performance. In this work, the research progress in liquid metal chip cooling is systematically reviewed, and the findings are organized into five core themes: cooling medium selection, channel design, driving pump analysis, system performance evaluation methods, and the co-design of liquid metal microfluidic chip cooling systems. This comprehensive review aims to provide theoretical references and technical guidance for liquid metal-based chip cooling technologies. The review was published in Journal of Thermal Science under the title “Liquid Metal-Based Chip Cooling Technologies”.