As an emerging thermal management solution, liquid metal-based chip cooling has become the subject of numerous seminal studies. This growing attention stems from the practicality and broad applicability of liquid metals in addressing the thermal management challenges posed by three-dimensional integrated circuits (3D ICs). With their superior heat transfer characteristics, liquid metals exhibit...
Microfluidic cooling technology has shown considerable potential in addressing the increasingly severe thermal management challenges of power electronic systems. However, most existing structural designs have not accounted for the constraint of a fixed heat transfer area, which limits the practical applicability and comparability of performance evaluations. In this study, the influence of diffe...
High heat flux is a critical factor limiting the performance and reliability of miniaturized high-power microelectronic systems. In this study, a liquid metal (LM)-based microfluidic cooling system is proposed, with a data-driven computational framework incorporating a learning-based genetic algorithm (LC-GA), aiming to provide efficient thermal management for high-density integrated systems. B...
High heat flux and local thermal stress have long been critical factors affecting the performance of three-dimensional integrated circuits (3D ICs). In this study, a fluid–solid coupled model incorporating embedded through-silicon via (TSV) structures is developed to design an enhanced microfluidic cooling system. Using computational fluid dynamics (CFD) simulations, the thermal performance of...
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